Abstract: Grinding is a key link in mineral processing, typically accounting for more than 50% of the total energy consumption. The particle size and liberation degree of grinding products directly determine the performance of subsequent separation processes. Traditional studies mostly analyze the grinding process from a mechanical perspective, but with the increasing utilization of complex and refractory ores, the regulating effects of slurry environments on grinding processes and product characteristics gradually attract attention. The mechanisms by which slurry physical properties, chemical conditions, gaseous components, and trace constituents influence grinding processes were systematically reviewed. Physical factors, including slurry concentration, rheological properties, and wettability, affect grinding processes by regulating particle motion states and energy transfer efficiency. pH, ionic strength, redox potential, and process reagents modify particle surface charges and electrical double-layer structures, thereby controlling the balance between particle dispersion and aggregation as well as the corrosion behavior of the grinding media. Dissolved gases and trace ions change mineral surface physicochemical properties and rheological thresholds through interfacial adsorption and multiphase interfacial reactions, thereby indirectly affecting crack initiation and propagation. The synergistic effects among these factors collectively determine grinding efficiency, specific energy consumption, and particle size distribution characteristics of the product. On this basis, the application prospect of slurry environment regulation for enhancing grinding performance was discussed, and future research directions were proposed, including multi-factor coupling mechanism analysis, synergistic optimization between grinding and mineral separation, dynamic regulation of slurry environments, and intelligent grinding technologies. Theoretical insights and technical reference were provided for the development of efficient, green, and intelligent grinding systems with precise particle size control.