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废旧电路板压力氧化—氰化提金试验研究

Experimental study on pressure oxidation-cyanide leaching for gold recovery from waste circuit boards

  • 摘要: 对市面购买的废旧电路板进行压力氧化—氰化提金试验研究,考察了物料细度、物料质量分数、氧化温度、氧化时间等对压力氧化预处理效果的影响。试验结果表明:在物料细度-0.25 mm占80 %、物料质量分数30 %、氧气分压2.0 MPa、氧化温度200 ℃、氧化时间3.0 h、硫酸用量90 kg/t、氧化剂用量25 kg/t条件下进行压力氧化预处理试验,而后在适宜条件下进行氰化提金试验,平均金浸出率可达92.52 %。

     

    Abstract: Experimental research was conducted on pressure oxidation-cyanide leaching for gold recovery from purchased waste circuit boards,investigating the effects of material fineness,material mass fraction,oxidation temperature,oxidation time,etc.,on the effectiveness of pressure oxidation pretreatment.The experimental results showed that conducting pressure oxidation pretreatment under conditions of material fineness of -0.25 mm accounting for 80 %,material mass fraction of 30 %,oxygen partial pressure of 2.0 MPa,oxidation temperature of 200 °C,oxidation time of 3.0 h,sulfuric acid dosage of 90 kg/t,and oxidant dosage of 25 kg/t,followed by cyanide leaching under appropriate conditions,resulted in an average gold leaching rate of 92.52 %.

     

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